This is a difficult one, I'm really excited about lithography and want to share my knowledge but since I'm working at one of those firms (dislcaimer here) I can share little...<p>So, let's stay safe and share some public knowledge:<p>1) The article mentions source power being a major factor and a huge improvement has been the addition of the prepulse (pancake). Here a great video showing how this concept works: <a href="https://www.youtube.com/watch?v=bRbHDtPbHe0" rel="nofollow">https://www.youtube.com/watch?v=bRbHDtPbHe0</a><p>2) Short, beginners level, introduction how the EUV source works (note: this movie is made before ASML tookover Cymer, so some history here): <a href="https://www.cymer.com/euv-lithography/how-an-euv-light-source-works" rel="nofollow">https://www.cymer.com/euv-lithography/how-an-euv-light-sourc...</a><p>3) Chris Mack's coverage of the last SPIE conferences give a nice summary of the field: <a href="http://www.lithoguru.com/scientist/conferences.html" rel="nofollow">http://www.lithoguru.com/scientist/conferences.html</a>
Note that Mack is an EUV-sceptic, his views on EUV are not commonly shared.
I wonder how they intend to expose wafers to this. As far as I know there are no materials that are transparent to EUV.<p>Even air is opaque, so you have to work in a vacuum.<p>So I'm wondering how they will vaporize bits of tin and not have the tin contaminate the wafers.