The focus in this thread appears to be on the wrong thing.
Intel has introduced a new process here for die interconnects <a href="http://www.intel.com/content/www/us/en/foundry/emib.html" rel="nofollow">http://www.intel.com/content/www/us/en/foundry/emib.html</a><p>This can be very interesting especially if this can be expanded to other products.
TSVs increase the pricing of certain products by a substantial margin and have pretty high failure rates, they also increase the internal resistance of components and can cause thermal issues.<p>HBM and 3Dxpoint built on EMIB can reduce the price of these components substantially, it can also make it viable again to split the dies of the IGP and the CPU allowing Intel have SKUs with different IGP configuration including EDRAM/SRAM without having to have multiple die designs.
The $64 G4560 making the i3 redundant, Kabylake X, and now this. This seems like a meltdown at Intel.<p>I think there is a real risk if AMD deliver superb performance and value with Zen, Intel will lose a little bit of the shine and a lot of consumers will not perceive them as innovative anymore.<p>The sheer number of skus itself shows Intel has been on a bit of a downward spiral towards becoming something of a 'marketing company'. Kabylake has negligible to no gains over skylake making it a pure branding exercise. Risky move for reputation. Time to focus on innovation and value.
EUV pushbacks from Applied Materials and ASML have pushed 10nm back quite a bit.<p>I honestly don't see Moore's law progressing beyond 3nm, maybe even stopping at 7nm or 10nm.