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Stanford Team Combines Logic, Memory to Build a 'High-Rise' Chip

45 pointsby craigjbover 10 years ago

2 comments

i_am_ralphtover 10 years ago
I wonder what the incremental process and cost for building these will be?<p>Intel used a silicon interposer to support a large amount of eDRAM in the recent IRIS graphics chips. It&#x27;d be amazing to have an ultra wide memory bus on mobile silicon...
评论 #8775323 未加载
guimarinover 10 years ago
IMO the real breakthrough here was the density of Carbon Nanotubes they are claiming.