TE
TechEcho
Home24h TopNewestBestAskShowJobs
GitHubTwitter
Home

TechEcho

A tech news platform built with Next.js, providing global tech news and discussions.

GitHubTwitter

Home

HomeNewestBestAskShowJobs

Resources

HackerNews APIOriginal HackerNewsNext.js

© 2025 TechEcho. All rights reserved.

Intel-Micron Share Additional Details of Their 3D NAND

39 pointsby Justenabout 10 years ago

1 comment

jjoonathanabout 10 years ago
Speaking of the HDD-&gt;SDD transition, is anyone familiar enough with SRAM and DRAM design&#x2F;fab to comment on why we haven&#x27;t seen a similar transition with memory? 60ns latency on a 4GHz processor = ouch!<p>I&#x27;m aware that SRAM is 3-6x less dense, but it isn&#x27;t uncommon these days to see people with &gt;3x the DRAM they need, so this doesn&#x27;t strike me as a terribly convincing justification.<p>I&#x27;m also aware that $&#x2F;GB is insanely high for on-CPU SRAM, but that would also be the case for on-CPU DRAM, which is why DRAM is typically put on a separate die so that its process can be optimized independently. Does the SRAM process just not optimize as well? Does it have insane power&#x2F;heat requirements? What goes wrong?<p>Or (puts on tinfoil hat) is JEDEC full of people who design DRAM memory controllers for a living?
评论 #9278140 未加载
评论 #9278657 未加载