I'm not an industry analyst, but the packaging issue seems a bit overblown.<p>Yes, packaging for this kind of high density design as an iPhone is very specialized, but it does not contain the precious IP and the security concerns it carries.<p>Also, iPhones and any costumer electronics at this level of complexity and scale will be assembled in China for the foreseeable future, and this is more like a stop in the middle of a journey than a round-trip.<p>Maybe this website is too Apple-focused, or maybe I'm missing something, but "older" technology makes the bulk of the ICs manufactured and is much more strategic than the latest Instagram filter accelerator processor. Maybe by value bleeding-edge nodes are bigger, but by volume they are not even close.<p>By the way, I won't miss if my car comes without infotainment with the latest GPU, but I surely hope the ABS processors are there. Or even the shitty microcontroller that every single button seems to hide nowadays.<p>And for most applications that do not require incredibly high density, there are plenty of packaging plants in the US (I google and got this [1] as a first result. Sorry, not an analyst). And even the advanced packaging seems to be getting attention that this article does not acknowledge [2].<p>[1] <a href="https://www.globalspec.com/local/4218/C_US" rel="nofollow noreferrer">https://www.globalspec.com/local/4218/C_US</a>
[2] <a href="https://semiengineering.com/expanding-advanced-packaging-production-in-the-u-s/" rel="nofollow noreferrer">https://semiengineering.com/expanding-advanced-packaging-pro...</a>