Just to check my understanding -- there's a 10x10 mm active interposer here, which has 64 "management-class" (MMU-less, I assume) cores, a crapload of interconnect, and a decent amount of I/O; and this can support up to a 5x5 array of chiplets bonded on top, each of which (of the current three) is either a quad core "application-class" processor (but still in-order), a tiny little FPGA (big question seems to be the width/capability of the DSP blocks), or something AI-ish that doesn't really interest me. Yes?<p>One question that immediately comes to mind is if there are a few pins on the interposer that are basically pass-through to the 2 x 2 mm chiplet on top, so that a chiplet that provides some level of I/O beyond what the interposer already has can be supported. I assume the UCIe links or something can be used as generic high speed SERDESes for that sort of use case, but more thinking about radar FEs and such.