Compute in memory is exciting, but it’s going to be hard to pull off. Transistors go underneath capacitors, which means they have to survive the subsequent fabrication of the capacitors without thermal processing disrupting their carefully engineered dopant profiles. It’s not just conservatism that keeps on die logic simple. Bonding, as suggested by the article, is probably the only option, but that brings some absolutely hilarious alignment issues along with it. I’m sure it’s coming, but it won’t be cheap.